F46复合薄膜及聚酰亚胺薄膜,fh,fhf薄膜
聚酰亚胺薄膜及F46复合薄膜
Polyimide film and F46 compound film
聚酰亚胺薄膜具有优良的耐高低温性、电气绝缘性、粘结性、耐辐射性、耐介质性，能在低至-269℃高至+400℃的温度范围内长期使用；复合亚胺薄膜还具有高温自粘性的特点，它们可作耐高温柔性印刷电路基材、扁平电路、电线电缆、电磁线的绝缘层以及用作各种电机的绝缘等。目前已广泛地应用于飞机、航天器、核工业、核潜艇、电力机车、音响器件、仪表通讯、石油化工等工业部门。
Polyimide film and F46 polyimide Fluoropolymer compounded film have excellent high-low temperature and radiation resistance, perfect electrical insulating properties, good adherence, and chemical resistance. Polyimide film can be used in temperature from low zero 269 to high 400℃ for a long span. Fluoropolymer compound film has self-bonding propertise, Both can be used in flexible printed circuits and as insulating materials of flat electric cables, electromagnetic wires and motors.
It is widely used in airplane, spacecrafts, nuclear industry, nuclear submarine, electric locomotive, Audio devices, communication equipment and in petrochemical industry.
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项目
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单位
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指标
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||||||
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Um
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25
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40
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50
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75
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100
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125
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||
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密度
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g/cm3
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1.42±0.2
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||||||
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拉伸强度
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纵向≥
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MPa
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170
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165
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150
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145
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130
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横向≥
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165
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160
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139
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130
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110
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|||
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延伸率≥
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%
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50
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60
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收缩率 (仅供参考,不作为供货依据)
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150℃(302F) 30分钟≤
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%
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0.2
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|||||
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400℃(752F) 30分钟≤
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2.0
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工频电气强度≥(48~62HZ)
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平均值
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MV/m
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180
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170
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160
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145
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120
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115
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个别值
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140
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135
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130
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120
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100
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90
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表面电阻率200℃(392F) ≥
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Ω
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1.0×1013
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体积电阻率200℃(392F) ≥
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Ω•m
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1.0×1010
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相对介电强度48~62Hz
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3.5±0.4
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介质损耗因数48~62Hz≤
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4.0×10-3
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